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To-263 footprint

To-263 footprint

Name: To-263 footprint

File size: 802mb

Language: English

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Related Documents - D2PAK (TO) package. Application Notes (5) General Information (1) Markings (1) Package Drawings (7) Pad Guidelines (1) Product. Package Family, TO Terminals, 3 Footprint Dimensions. Packing Footprint. Footprint Dimensions PG-TO 01_00 | Jul 09, | PDF | 80 kb. PG-TO Overview. General Information. Package Material, PG. Package Family, TO Terminals, 7. Version, 3. Exposed Paddle, Yes.

B) REFERENCE JEDEC, TO, VARIATION AB. C) DIMENSIONING AND TOLERANCING PER. DIMENSIONING AND TOLERANCING PER. ASME Y . TOAB/D2PAK (FS PKG Code 45). TOAB/D2PAK Package Dimensions. August , Rev. A. Scale on letter size paper. Dimensions shown. The D2PAK or DDPAK, standardized as TO, refers to a semiconductor package type intended for surface mounting on circuit boards. They are similar to the.

Dimensions, PCB land patterns, footprints, thermal resistances, soldering tips, common uses, synonyms and more info for the D2PAK (TO). ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS. Note: The suggested land pattern dimensions have been provided for. This application note describes the TO– THIN Package. . Footprint/drop-in compatible with the standard TO package but with a thinner and smaller.

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